雾化介质对无铅焊锡粉末形貌及粒度分布的影响

利用自行设计的超音速雾化制粉装置,研究不同雾化介质对SnAgCu系无铅焊锡粉末有效雾化率、粒度分布及球形度的影响。结果表明:在一定雾化条件下,氦气雾化粉末具有最高的有效雾化率,最佳的球形度、表面光滑度及粒度分布;氮气雾化的粉末具有较好的综合性能;与氦气、氮气相比,氩气雾化粉末综合性能较差;空气雾化粉末雾化率较高,但粉末较粗、表面粗糙。

Effect of atomizing medium on micrograph and size distribution of free-lead solder powder

The experiment studies the effects of atomizing medium on the properties such as efficient atomization efficiency, distribution of size, sphericity of free-lead solder powder of Sn-Ag-Cu system with supersonic atomization equipment designed by ourselves. The results show that distribution of size, smoothness, sphericity of free-lead solder powder, and the efficient atomization efficiency are optimum with helium as atomizing medium, combined property of the powder is favorite with nitrogen as atomizing medium, combined property of the powder with argon as atomizing medium is inferior to that with nitrogen and helium as atomizing medium,the powder with air as the atomizing medium is better in the efficient atomization efficiency, but the particles are coarser in size and rougher in surface.