浅谈如何提高焊膏印刷的质量

随着现代科学技术的发展,表面组装技术也在不断地发展和完善。目前,组装所用的元件越来越趋于小型化,装配密度也越来越高,器件间距和印刷焊盘之间的间隙越来越小。为保证产品的高性能和高质量,求提高焊膏的印刷分辨率,控制好焊膏的印刷质量,减少焊锡桥连、虚焊、立碑等问题的出现,从而提高SMT产品的质量。

How to Improve Quality of Solder Paste Printing

With the development of modern science and technology, surface mounting technology develops constantly and becomes perfect. Currently, assembly components tend towards miniaturization, and packaging density becomes higher and higher.The component separation and clearance ofsoldering board become smaller and smaller. To guarantee the high performance and quality of product, it is necessary to improve the printing resolution of soldering paste, control the printing quality of soldering paste and reduce the occurrence of solder bridging, cold joint and tomb stone so as to improve the quality of SMT products.