碳纤维表面化学镀铜工艺的优化

以甲醛为还原剂对碳纤维表面进行化学镀铜,利用正交实验对碳纤维化学镀铜工艺进行了优化,研究了施镀时间与镀层厚度及导电性之间的关系,确定了较理想的化学镀铜工艺。结果表明,采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀,光泽性好,镀层结合力强,导电性能显著提高。

Optimization of process conditions for electroless copper plating on carbon fiber

Electroless copper plating on carbon fiber using formaldehyde as reducing agent was introduced and the process conditions for electroless copper plating on carbon fiber were optimized through orthogonal test. The relationship between the plating time and the copper layer thickness, electrical conductivity were studied, and the optimal process conditions were determined. The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good adhesion and high electrical conductivity.