| 高档电解铜箔研究及产业化 |
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| 引用本文： | 徐树民,冷大光. 高档电解铜箔研究及产业化[J]. 材料导报, 2000, 14(5): 6-7 |
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| 作者姓名： | 徐树民 冷大光 |
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| 作者单位： | 招远电子材料厂,山东,招远,265400 |
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| 摘 要： | 介绍了招远电子材料厂开展高档电解铜箔课题研究的过程,解决的主要技术难题,取得的成果以及成果转化后所取得的经济效益,并探讨了铜箔研究发展趋势及下一步研究开发工作的重点。
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| 关 键 词： | 电解铜箔 成果产业化 生产工艺 电子材料 |
Research on High-rank Electrodeposited Copper Foil and Commercialization of Its Results |
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| Xu Shumin,Leng Daguang. Research on High-rank Electrodeposited Copper Foil and Commercialization of Its Results[J]. Materials Review, 2000, 14(5): 6-7 |
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| Authors: | Xu Shumin Leng Daguang |
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| Abstract: | This article offers a brief overview of our study of high-rank electrodeposited copper foil,including the process of the research,the main technical challenges,the research results and the economic benefits from their commercialization. This article also discusses future trends and research directions of priority in the area. |
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| Keywords: | high-rank copper foil technological research commercialization |
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