基于速度阻尼力位切换DSP算法的引线键合机邦头设计

引线键合是半导体后道封装中重要环节，实现芯片与外部框架的电气信号连接。其中，键合邦头的力位控制是引线键合的关键。从应用角度出发，分析切换过程与影响力位切换的相关因素，设计了一种基于速度阻尼力位切换DSP算法的引线键合机邦头控制器。实验数据表明：在整个力位切换过程中，加力平稳，键合邦头在力位切换过程中的振动得到了很好的抑制，具有较高的应用价值。

Design of Bond Head for Bonding Wire Key Machine Based on Speed Damping Force-position Switching DSP Algorithm

Wire bonding is an important link in semiconductor afterpackaging, electrical connection between chip and external frame. Among them, bonding head force position control is the key of the wire bonding.From the view of application, switching process and influence factors about force position switch were analyzed, a kind of wire bonding machine head controller was designed based on speed damping force-position switching DSP algorithm. The experimental data show that in the whole force-position switching process, loading is stable, vibration of bond head in the switching process is well controlled. It has higher application value.