Particle size effects in the thermal conductivity enhancement of copper-based nanofluids |
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Authors: | Michael Saterlie Huseyin Sahin Barkan Kavlicoglu Yanming Liu Olivia Graeve |
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Affiliation: | (1) Kazuo Inamori School of Engineering, Alfred University, 2 Pine Street, 14802 Alfred, NY, USA;(2) Advanced Materials and Devices, Inc, 4750 Longley Lane #104, 89502 Reno, NV, USA |
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Abstract: | We present an analysis of the dispersion characteristics and thermal conductivity performance of copper-based nanofluids.
The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant,
oleic acid or cetyl trimethylammonium bromide (CTAB). Nanofluids were prepared using water as the base fluid with copper nanoparticle
concentrations of 0.55 and 1.0 vol.%. A dispersing agent, sodium dodecylbenzene sulfonate (SDBS), and subsequent ultrasonication
was used to ensure homogenous dispersion of the copper nanopowders in water. Particle size distribution of the copper nanoparticles
in the base fluid was determined by dynamic light scattering. We found that the 0.55 vol.% Cu nanofluids exhibited excellent
dispersion in the presence of SDBS. In addition, a dynamic thermal conductivity setup was developed and used to measure the
thermal conductivity performance of the nanofluids. The 0.55 vol.% Cu nanofluids exhibited a thermal conductivity enhancement
of approximately 22%. In the case of the nanofluids prepared from the powders synthesized in the presence of CTAB, the enhancement
was approximately 48% over the base fluid for the 1.0 vol.% Cu nanofluids, which is higher than the enhancement values found
in the literature. These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water,
as determined from dynamic light scattering. |
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