| 化学机械抛光中抛光垫材料的研究与展望 |
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| 引用本文： | 李振,邓乾发,郑晓锋,刘盾,王羽寅,袁巨龙. 化学机械抛光中抛光垫材料的研究与展望[J]. 新技术新工艺, 2010, 0(12): 73-77 |
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| 作者姓名： | 李振 邓乾发 郑晓锋 刘盾 王羽寅 袁巨龙 |
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| 作者单位： | [1]浙江工业大学超精密加工研究中心,浙江杭州310014 [2]特种装备制造与先进加工技术教育部／浙江省重点实验室,浙江杭州310014 [3]宁波市特种设备检验研究院,浙江宁波315020 |
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| 基金项目： | 浙江省科技厅项目，浙江省大学生科技创新活动计划(新苗人才计划)，浙江工业大学科研启动资助项目 |
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| 摘 要： | 在化学机械抛光中,抛光垫的材料是重要影响因素之一,它直接影响着抛光效果。本文介绍了化学机械抛光垫的基本材料、材料特性及其对抛光效果的影响,目前化学机械抛光加工中所采用的抛光垫材料及主要用途,对各种抛光垫材料在抛光过程中存在问题进行了分析,同时展望了抛光垫材料的发展趋势。
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| 关 键 词： | 化学机械抛光 抛光垫 材料 |
Study of Material of CMP Polishing Pad |
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| LI Zhen,DENG Qianfa,ZHENG Xiaofeng,LIU Dun,WANG Yuyin,YUAN Julong. Study of Material of CMP Polishing Pad[J]. New Technology & New Process, 2010, 0(12): 73-77 |
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| Authors: | LI Zhen DENG Qianfa ZHENG Xiaofeng LIU Dun WANG Yuyin YUAN Julong |
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| Affiliation: | 1.Ultra-precision Machining Research Center,Zhejiang University of Technology,Hangzhou 310014,China;2.Key Laboratory of E＆M,Ministry of Education ＆ Zhejiang Province,Hangzhou 310014,China;3.Ningbo Special Equipment Inspection Center,Ningbo 315020,China) |
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| Abstract: | In the chemical mechanical polishing process,the material is one of most critical elements of polishing pad performance,which directly influences the polishing process and results.The basic materials characters and their effects on polishing are described.Various sorts of research contents about materials and characters of polishing pad are shown.The expectations for the solution of present problems in researches and studies were proposed in the final. |
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| Keywords: | Chemical mechanical polishing Polishing pad Material |
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