Thermal deformation measurement of the solder joints in electronic packages using electron moiré method

In this paper, electron moiré method is used to measure the thermal deformation of electronic packages. In order to observe the electron moiré fringe, a holographic grid was replicated on the cross section of the BGA type package at 150°C. This grid was fabricated on a glass plate using a moving point holographic system, and was replicated to measured area at high temperature. Under SEM, the holographic grid(specimen grid) and a programmed electron beam scan(master grid) interfere and form electron moiré patterns. The shear strain measurement technique using electron moiré method is described. Using the electron moiré method, the shear strains in the different solder joints were measured and analysed. Some useful results were obtained.