| 金刚刀划片过程中的崩缺问题应对方案 |
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| 引用本文： | 肖海滨. 金刚刀划片过程中的崩缺问题应对方案[J]. 中国集成电路, 2014, 0(3): 57-60 |
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| 作者姓名： | 肖海滨 |
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| 作者单位： | 上海华虹集成电路有限责任公司,上海201203 |
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| 摘 要： | 本文针对金刚刀划片崩缺问题,对比双刀划片和单刀划片试验,分析了崩缺产生的原因,提出了窄划片槽晶圆金刚刀划片崩缺问题的应对方案。金刚刀划片采用双刀划片降低崩缺风险优于单刀划片工艺,双刀划片刀宽度越窄有利于降低崩缺,第一刀切深1/3厚度有利于降低崩缺风险。
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| 关 键 词： | 金刚刀 划片 崩缺 |
Wafer Chipping Solutions of Diamond Blade Dicing |
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| XIAO Hai-bin. Wafer Chipping Solutions of Diamond Blade Dicing[J]. China Integrated Circuit, 2014, 0(3): 57-60 |
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| Authors: | XIAO Hai-bin |
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| Affiliation: | XIAO Hai-bin (Shanghai Huahong Integrated Circuit Co.,Ltd, Shanghai, 201203, China) |
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| Abstract: | for wafer chipping issue, the paper provides chipping solutions of diamond blade dicing according to the reason of chipping. The chipping risk of double blade dicing process is lower than single blade, more narrow blades are in favor of decreasing chipping risk, the first depth up to 1/3 wafer thickness help to reduce the risk of chipping. |
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| Keywords: | Diamond Blade Dicing Chipping |
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