| 纯铜低周疲劳中的温度响应与微观形貌变化 |
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| 引用本文： | 李娜,童小燕,姚磊江. 纯铜低周疲劳中的温度响应与微观形貌变化[J]. 材料科学与工程学报, 2006, 24(5): 754-757 |
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| 作者姓名： | 李娜 童小燕 姚磊江 |
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| 作者单位： | 1. 西北工业大学,航空学院,陕西,西安,710072;西北工业大学,国防科技研究院,陕西,西安,710072
2. 西北工业大学,国防科技研究院,陕西,西安,710072 |
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| 基金项目： | 西北工业大学校科研和教改项目 |
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| 摘 要： | 为了研究纯铜在低周疲劳中的温度响应与微观形貌,借助于红外热像仪及远距离高倍显微镜同步监测工业纯铜的表面疲劳变化,同时运用扫描电子显微镜(SEM)对试样断口进行微观分析.研究结果表明:试样表面温度的变化与表面微观形貌的变化具有明显的相关性,并受应力水平及加载频率的影响,表面最高温升与加载频率呈线性关系;试样断口出现明显的裂纹扩展区和瞬断区,且随着应力水平及加载频率的增加而形成较大的瞬断区及较多的韧窝.
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| 关 键 词： | 温度响应 微观形貌 低周疲劳 应力水平 加载频率 工业纯铜 低周疲劳 温度响应 表面微观形貌 形貌变化 Low Cycle Fatigue Pure Copper Response 韧窝 瞬断区 裂纹扩展区 线性关系 温升 影响 加载频率 应力水平 相关性 表面温度 结果 微观分析 |
| 文章编号： | 1673-2812(2006)05-0754-04 |
| 修稿时间： | 2005-11-10 |
Temperature Response and the Micrograph Change of Pure Copper under Low Cycle Fatigue |
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| LI Na,TONG Xiao-yan,YAO Lei-jiang. Temperature Response and the Micrograph Change of Pure Copper under Low Cycle Fatigue[J]. Journal of Materials Science and Engineering, 2006, 24(5): 754-757 |
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| Authors: | LI Na TONG Xiao-yan YAO Lei-jiang |
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| Abstract: | The temperature response and the micrograph change of pure copper under low cycle fatigue(LCF) were studied by use of infrared thermography and optical microscopy,and the fracture morphology was analyzed with Scan Electron Microscopy(SEM).The results show that there are obvious relationships between the temperature response and the microscopic shape,furthermore,the stress level and the load frequency effect the change of the surface temperature.There exists a specifically linear relation between the highest temperature rising and the load frequency.The fracture morphology appears obvious extend zone of crack and instant rupture zone,which is larger and possesses more dimple along with the increasing stress level and load frequency. |
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| Keywords: | temperature response micrograph low cycle fatigue(LCF) stress level load frequency |
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