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陶瓷与金属扩散连接的研究现状
引用本文:刘会杰,冯吉才,李广,王跃国. 陶瓷与金属扩散连接的研究现状[J]. 焊接, 2000, 0(9): 7-12
作者姓名:刘会杰  冯吉才  李广  王跃国
作者单位:1. 哈尔滨工业大学焊接国家重点实验室,150001
2. 大兴安岭地区交通征费稽查处,165000
摘    要:陶瓷与金属的连接技术是材料工程领域的热点研究课题,而扩散连接方法被认为是陶瓷与金属连接最适宜的方法。本文综述了陶瓷与金属扩散连接的研究现状,重点介绍了界面反应研究、残余应力分析和连接工艺研究等内容,并在此基础上指出了研究中所存在的问题。

关 键 词:陶瓷/金属接头 扩散连接 界面反应 应力分析

RESEARCH STATUS QUO OF DIFFUSION BONDING OF CERAMICS TO METALS
Liu Huijie,Feng Jicai,Li Guang,Wang Yueguo. RESEARCH STATUS QUO OF DIFFUSION BONDING OF CERAMICS TO METALS[J]. Welding & Joining, 2000, 0(9): 7-12
Authors:Liu Huijie  Feng Jicai  Li Guang  Wang Yueguo
Affiliation:Traffic Taxation Checking Office Daxinganling Prefecture
Abstract:The bonding technique of ceramics to metals is one of the central issues in materials engineering, and diffusion bonding is considered to be the most suitable method for bonding ceramics to metals. The research status quo of diffusion bonding of ceramics to metals is reviewed in this paper, and the emphases are placed on the interface reaction, stress analysis and bonding technology. Based on this, the unsolved issues in researches are pointed out.
Keywords:ceramic -metal joint   diffusion bonding   interface reaction   stress analysis  
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