| 表面贴装技术的工艺参数对共晶SnPb焊料与铜焊接界面的影响 |
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| 引用本文： | 肖代红,吴金昌,高翔,陈方泉.表面贴装技术的工艺参数对共晶SnPb焊料与铜焊接界面的影响[J].理化检验(物理分册),2005,41(10):497-500. |
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| 作者姓名： | 肖代红 吴金昌 高翔 陈方泉 |
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| 作者单位： | 英顺达科技有限公司研发品保中心,上海,201114 |
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| 摘 要： | 采用扫描电镜与能谱分析方法,研究了表面贴装技术的工艺参数（包括恒温区保温时间、传送带速度、锡膏粘度和锡膏模板厚度等）对共晶SnPb焊料与铜焊接界面的影响.结果显示,表面贴装技术工艺参数并不明显影响焊接界面金属间化合物（IMCs）层的组成（IMCs层的主要成分为Cu6Sn5相）,但影响IMCs层的形貌,其中传送带速度会影响Cu6Sn5相的平均直径,而锡膏模板厚度与恒温区保温时间则对IMCs层的形态与厚度影响较大.
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| 关 键 词： | 工艺参数 焊接界面 金属间化合物层 |
| 文章编号： | 1001-4012（2005）10-0497-04 |
| 收稿时间： | 2005-01-21 |
| 修稿时间： | 2005-01-21 |
EFFECT OF SURFACE MOUNT TECHNOLOGY PROCESS PARAMETER ON THE SOLDERING INTERFACE BETWEEN EUTECTIC SnPb SOLDER AND Cu SUBSTRATE |
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| XIAO Dai-hong,WU Jin-chang,GAO Xiang,CHEN Fang-quan.EFFECT OF SURFACE MOUNT TECHNOLOGY PROCESS PARAMETER ON THE SOLDERING INTERFACE BETWEEN EUTECTIC SnPb SOLDER AND Cu SUBSTRATE[J].Physical Testing and Chemical Analysis Part A:Physical Testing,2005,41(10):497-500. |
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| Authors: | XIAO Dai-hong WU Jin-chang GAO Xiang CHEN Fang-quan |
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| Affiliation: | Research and Quality Assurance Center, Inventec Corporation, Shanghai 201114, China |
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| Abstract: | Effect of surface mount technology process parameter,including conveyer speed,isothermal time,solder paste viscosity,thickness of solder paste form board on the soldering interface between eutectic SnPb solder and Cu substrate was investigated with scanning electron microscope and energy dispersive X-ray spectroscopy).It was found that surface mount technology process parameter did not affect the composition of Cu_6Sn_5 phase in intermetallic compounds(IMCs) layer between the eutectic SnPb solder and Cu substrate.However,the SMT process parameter,especially the isothermal time and the thickness of solder paste form board,changed the shape and thickness of IMCs layer. |
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| Keywords: | Process parameter Welding interface Intermetallic Compounds layer |
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