| 阴离子对化学镀Ni-Cu-P合金耐蚀性的影响 |
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| 引用本文： | 刘重阳,刘贵昌,王随林,王立达.阴离子对化学镀Ni-Cu-P合金耐蚀性的影响[J].辽宁化工,2010,39(8):794-796. |
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| 作者姓名： | 刘重阳 刘贵昌 王随林 王立达 |
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| 作者单位： | 1. 大连理工大学化工学院,辽宁,大连,116012
2. 北京建筑工程学院城建系,北京,100044 |
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| 基金项目： | 北京自然科学基金和北京市教委科研攻关计划支持资助，北京市科学技术委员会 |
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| 摘 要： | 采用化学镀工艺在铜基体表面沉积Ni-Cu-P镀层,利用扫描电镜(SEM)和电子能谱(EDX)对Ni-Cu-P镀层的形貌和成分进行了分析。同时,采用极化曲线(PC)和交流阻抗(EIS)研究了常温下Ni-Cu-P镀层在0.1 mol/L,0.001 mol/L的NaCl,Na2SO4,NaNO3和NaNO2电解质中的耐蚀性能。结果表明,在较高浓度下,氯离子和硫酸根离子的活性吸附作用能够促进镀层中Ni的溶解,从而也加速了镀层的表面钝化,在较低浓度下,氯离子和硫酸根离子的活性吸附作用减弱,镀层很难钝化;硝酸根离子和亚硝酸根离子在高浓度和低浓度下均很难使镀层钝化。
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| 关 键 词： | 化学镀 Ni—Cu—P 耐蚀性能 钝化 |
Effects of Anions on Corrosion behavior of Ni-Cu-P Coating |
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| LIU Chong-yang,LIU Gui-chang,WANG Sui-lin,WANG Li-da.Effects of Anions on Corrosion behavior of Ni-Cu-P Coating[J].Liaoning Chemical Industry,2010,39(8):794-796. |
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| Authors: | LIU Chong-yang LIU Gui-chang WANG Sui-lin WANG Li-da |
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| Affiliation: | 1(1.Department of Chemical Engineering,Dalian University of Technology,Dalian 116012,China;2.Urban Construction Department,Beijing Institute of Civil Engineering and Architecture,Beijing 100044,China) |
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| Abstract: | Ni-Cu-P coating was synthesized on copper substrate by electroless plating technique.The coating morphology and com-position were characterized by SEM and EDX.The corrosion resistance of Ni-Cu-P coating was studied by PC and EIS.The results show that at a higher electrolyte concentration,Cl-and SO42-ions promote the dissolution rate of Ni by their adsorption,and accelerate the passivation of Ni-Cu-P coating,at lower electrolyte concentration,Ni-Cu-P coating is not easy to passivate as the reducing of the adsorption effect of Cl-and SO42-,NO 3-and NO 2-can not accelerate the passivation of Ni-Cu-P coating either at higher or lower electrolyte concentration. |
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| Keywords: | Ni-Cu-P |
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