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基体预热温度对涂层表面形貌及残余应力影响的数值模拟
引用本文:渠志刚,贺辛亥,刘江南,邢圆圆,钟鹏.基体预热温度对涂层表面形貌及残余应力影响的数值模拟[J].表面技术,2017,46(7):57-64.
作者姓名:渠志刚  贺辛亥  刘江南  邢圆圆  钟鹏
作者单位:西安工程大学 机电工程学院,西安,710048;西安工程大学 机电工程学院,西安,710048;西安工程大学 机电工程学院,西安,710048;西安工程大学 机电工程学院,西安,710048;西安工程大学 机电工程学院,西安,710048
基金项目:西安市科技计划项目(CXY1425);西安工程大学研究生创新基金项目(CX201633)
摘    要:目的为了更好地研究分析不同的基体预热温度对所制备涂层质量的影响。方法采用求解热传导和能量方程,运用有限体积FVM法、流体体积跟踪法VOF追踪熔滴自由表面,建立熔滴撞击基体的三维几何模型,模拟了层片形成过程,分析不同基体预热温度对层片表面形貌的影响以及熔滴内部液滴形态变化的过程,在上述基础上,继续模拟第2个熔滴撞击在已凝固层片,从而形成涂层,进一步分析了不同基体预热温度对涂层表面形貌和残余应力的影响规律。结果随着基体预热温度的提高,沉积物与基体之间的温度梯度减少,有利于熔滴的铺展,铺展时间变长,气体的排放更顺畅,层片中的孔隙率降低,且层片铺展厚度随温度的提高而逐渐降低,而铺展半径逐渐增大,沉积物形貌更接近圆盘状。随着基体预热温度的提高,最终涂层形貌都是边缘厚、中间薄,但涂层中央的致密程度不断提高,且组织中的孔隙量越来越低。结论基体预热温度需处在一个范围,涂层的残余应力才会有一个最优值,使得涂层与基体有比较好的结合强度。

关 键 词:模拟  基体预热温度  表面形貌  层片  涂层  残余应力
收稿时间:2017/3/26 0:00:00
修稿时间:2017/7/20 0:00:00

Numerical Simulation of Influence of Substrate Preheating Temperature on Coating Morphology and Residual Stress
QU Zhi-gang,HE Xin-hai,LIU Jiang-nan,XING Yuan-yuan and ZHONG Peng.Numerical Simulation of Influence of Substrate Preheating Temperature on Coating Morphology and Residual Stress[J].Surface Technology,2017,46(7):57-64.
Authors:QU Zhi-gang  HE Xin-hai  LIU Jiang-nan  XING Yuan-yuan and ZHONG Peng
Affiliation:School of Mechanical & Electrical Engineering, Xi''an Polytechnic University, Xi''an 710048, China,School of Mechanical & Electrical Engineering, Xi''an Polytechnic University, Xi''an 710048, China,School of Mechanical & Electrical Engineering, Xi''an Polytechnic University, Xi''an 710048, China,School of Mechanical & Electrical Engineering, Xi''an Polytechnic University, Xi''an 710048, China and School of Mechanical & Electrical Engineering, Xi''an Polytechnic University, Xi''an 710048, China
Abstract:The work aims to better study effects of different substrate preheating temperature on as-prepared coating quality. Based upon heat conduction and energy equation, free surface of molten droplets was tracked in finite volume method (FVM) and fluid volume tracking method (VOF), and 3D geometry model in which droplets strike the substrate was built to simulate slice forming process. Effects of different substrate preheating temperature on the slice morphology and morphologic change process of internal droplets were analyzed. On this basis, the second droplet striking solidified slice was simulated to form the coatings. Law of influence of different substrate preheating temperature on coating morphology and residual stress was further analyzed. As substrate preheating temperature rose, temperature gradient between sediment and substrate decreased, which was conducive to the spreading of droplets. As spreading time advanced, gas was emitted more smoothly and porosity in slice decreased. The slice spreading thickness decreased gradually as temperature rose. Spreading radius increased gradually and morphology of the sediment was more close to discoid. Final coating morphology featured in thick edges and thin center as the substrate temperature rose. However, center density of coating increased constantly and void volume in the structure decreased gradually. Substrate preheating temperature shall fall in a certain range, then residual stress is likely to have an optimal value which guarantees better bonding strength between the coating and substrate.
Keywords:modeling  substrate preheating temperature  morphology  slice  coating  residual stress
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