Young’s modulus and interlaminar fracture toughness of SU-8 film on silicon wafer

SU-8 cantilever beams deposited on the polished sides or unpolished sides of silicon wafers were fabricated by MEMS and bulk micro-machining techniques. Bending tests were conducted to measure the Young’s modulus and interface fracture toughness. The results indicate that the Young’s modulus is increasing as the width of specimens is increasing because the specimen quality becomes better. When the width of SU-8 cantilever beam is 400 μm, the Young’s modulus is about 3.5 GPa. On the other hand, since the interface between SU-8 and silicon wafer does not suffer the attack of etchant, the measured interface fracture toughness has no clear dependence on the specimen width. The averaged interface fracture toughness is about 25–30 J/m² for the polished interface and 15–20 J/m² for the unpolished interface.