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| IC封装模流道平衡CAE应用 | |
| 引用本文： | 曹阳根,傅意蓉,王元彪,陈建.IC封装模流道平衡CAE应用[J].模具工业,2004(5):34-37. |
| 作者姓名： | 曹阳根 傅意蓉 王元彪 陈建 |
| 作者单位： | 1. 上海工程技术大学,上海,200036 2. 上海柏斯高模具有限公司,上海,200035 3. 美国Moldflow公司上海办事处,上海,200122 |
| 摘 要： | 分析了热固性塑料的流动行为特点和IC封装充填过程中料流对金丝的冲击状态。用CAE软件Moldflow公司的MPA对流道的平衡进行分析模拟 ,优化浇注系统 ,为提高IC封装产品合格率寻找一种简便有效的途径。 |
| 关 键 词： | IC封装 流道平衡 CAE |
| 文章编号： | 1001-2168(2004)05-0034-04 |
| 修稿时间： | 2003年11月25 |
The Application of CAE in Runner Balance of IC Encapsulation Moulds |
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| CAO Yang-gen ,FU Yi-rong ,WANG Yuan-biao ,CHEN Jian.The Application of CAE in Runner Balance of IC Encapsulation Moulds[J].Die & Mould Industry,2004(5):34-37. | |
| Authors: | CAO Yang-gen FU Yi-rong WANG Yuan-biao CHEN Jian |
| Affiliation: | CAO Yang-gen 1,FU Yi-rong 1,WANG Yuan-biao 2,CHEN Jian 3 |
| Abstract: | The flow behavior characteristics of thermosetting plastics and the impact of plastic flow to gold wires in the course of filling for IC encapsulation are analyzed.The CAE software MPA of Moldflow Company has been used to conduct the analysis and simulation of the runner balance and the optimization of the runner system.It provides a simple and effective approach for increasing the ratio of up-to-grade IC encapsulating products. |
| Keywords: | IC encapsulation runner balance CAE |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |