基于分形理论的三维系统封装微通道布局设计

为了更好地解决大功率三维系统封装(3D-SIP)芯片散热的问题,将分形理论和翅片型微通道相结合,应用于微米级的微通道布局中,形成新型的平行翅片型微通道、交错翅片型微通道、树状翅片型微通道3种布局.在ANSYS的FLOTRAN中建立了相应模型,得到了大功率芯片结温、芯片温差和3D-SIP的热阻,比较了3种微通道布局对大功率3D-SIP散热特性的影响.研究结果表明,相比其他两种微通道布局,树状翅片型微通道布局使3D-SIP的大功率芯片散热效果最好,为大功率3D-SIP的散热设计提供了很好的参考依据.

Design of Micro-Channel Layout on 3D System in Package Based on Fractal Theory

In order to better solve the heat dissipation problem of high power 3D system in package(3D-SIP ),the fractal theory and fin-type micro-channel were combined and applied to the design of micron level micro-channel layout in this work,and three types of micro-channel layouts such as parallel fintype micro-channel layout, stagger fin-type micro-channel layout and tree fin-type micro-channel layout were formed. Based on the FLOTRAN in ANSYS, the corresponding models for the different layouts were established to simulate the junction temperature of high power chip, the chip temperature difference and thermal resistance of 3D-SIP. In addition, the effects of the three new micro-channel layouts on the heat dissipation characteristics of 3D-SIP were compared. The results show that tree fin-type micro-channel layout can help the high power chips of 3D-SIP dissipate heat more efficiently comparing with the other two micro-channel layouts, which provides a useful method for high power 3D-SIP heat dissipation design.