多排焊盘外壳封装IC金丝球焊键合技术

在多层多排焊盘外壳封装电路的引线键合中,由于键合的引线密度较大,键合引线间的距离较小,键合点间的距离也较小,在电路的键合中就需要对键合点的位置、质量、键合引线的弧线进行很好的控制,否则电路键合就不能满足实际使用的要求。文中就高密度多层、多排焊盘陶瓷外壳封装集成电路金丝球焊键合引线的弧线控制、外壳焊盘常规植球键合点质量问题进行了讨论,通过对键合引线弧线形式的优化以及采用"自模式"植球键合技术大大提高了电路键合的质量,键合的引线达到工艺控制和实际使用的要求。同时,外壳焊盘上键合的密度也得到了提高。

Investigation on Gold Ball Bonding Technologies for High-density Ceramic Package

As the decreasing of bonding-pad pitch of ball bonds, fine-pitch bonding has become the leading edge of wire bonding technology, especially for high-density ceramic package. The position of the bonding and the wire looping must be controlled more precisely in order to meet the reliability requirements. The looping technologies and high-density ceramic package which related reliability issues are discussed in detail in this article. A new technology named "self mode" was adopted and it was found that high quality, reliable wire bonding can be obtained by carefully controlling the bond loops.