| 封装中的界面热应力分析 |
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| 引用本文： | 蒋长顺,谢扩军,许海峰,朱琳.封装中的界面热应力分析[J].电子与封装,2006,6(8):23-25,32. |
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| 作者姓名： | 蒋长顺 谢扩军 许海峰 朱琳 |
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| 作者单位： | 电子科技大学物理电子学院,成都,610054 |
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| 摘 要： | 随着电子封装集成度的不断提高,集成电路的功率容量和发热量也越来越高,封装体内就产生了越来越多的温度分布以及热应力问题。文章建立了基板-粘结层-硅芯片热应力分析有限元模型,利用有限元法分析了芯片/基板的热应力分布,封装体的几何结构参数对应力的影响,重点讨论了芯片与粘结层界面上和基板与粘结层界面上的层间应力分布
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| 关 键 词： | 金刚石基板 有限元法 热应力 |
| 文章编号： | 1681-1070（2006）08-0023-03 |
| 收稿时间： | 2006-04-21 |
| 修稿时间： | 2006-04-21 |
Interfacial Thermal Stress Analysis in Packaging |
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| JIANG Chang-shun,XIE Kuo-jun,XU Hai-feng,ZHU Lin.Interfacial Thermal Stress Analysis in Packaging[J].Electronics & Packaging,2006,6(8):23-25,32. |
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| Authors: | JIANG Chang-shun XIE Kuo-jun XU Hai-feng ZHU Lin |
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| Affiliation: | School of Physical Electronics, University of Electronic Science and Technology of China, Chengdu 610054, China |
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| Abstract: | With the increasing of packaging integration the power and the quantity of heat of integrate circuit will increase, it will bring more and more temperature distributions and problems about thermal stresses in package. In this paper a finite element thermal stress model of substrate-adhesive-chip is established, thermal stress distribution of substrate-chip interfaces and the affects of geometrical structure on thermal stresses are analyzed by finite element method especially discuss interfacial thermal stresses distributions on chipadhesive interface and adhesive-substrate interface. |
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| Keywords: | diamond substrate finite element method thermal stress |
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