| 氮化铝陶瓷与铜界面传热计算机仿真 |
| |
| 引用本文： | 王粟,王雪波. 氮化铝陶瓷与铜界面传热计算机仿真[J]. 武汉理工大学学报, 2006, 28(6): 14-16 |
| |
| 作者姓名： | 王粟 王雪波 |
| |
| 作者单位： | 湖北工业大学电气工程学院,武汉,430068 |
| |
| 摘 要： | 固体界面热阻是航空航天、低温与超导、微电子技术等领域中研究热点问题，氮化铝陶瓷和金属铜被广泛应用于低温超导装置和集成电路芯片。基于氮化铝陶瓷与金属铜样品之间界面热阻的低温实验，应用MATLAB软件对实验数据进行回归分析，建立了氮化铝陶瓷与铜之间界面热阻与温度、压力等参数的回归分析仿真模型，仿真结果与实验数据有较好的一致性。研究结果对氮化铝陶瓷、铜应用于超导装置和集成电路芯片的传热设计、空间热控制具有重要意义。
|
| 关 键 词： | 界面热阻 回归分析 仿真 氮化铝 铜 |
| 文章编号： | 1671-4431(2006)06-0014-03 |
| 修稿时间： | 2006-01-23 |
The Computer Simulation of Heat Transfer Process Between AlN Ceramic and Copper |
| |
| WANG Su,WANG Xue-bo. The Computer Simulation of Heat Transfer Process Between AlN Ceramic and Copper[J]. Journal of Wuhan University of Technology, 2006, 28(6): 14-16 |
| |
| Authors: | WANG Su WANG Xue-bo |
| |
| Abstract: | The interface thermal resistance was the basic science problem in the fields of cryogenics,aerospace,superconducting and microelectronic technology etc.The AlN(ceramic material) and Copper have been widely used in the cryogenic superconducting devices and integrated circuit chips.Based on the low temperature experiment of interface thermal resistance between AlN ceramic and copper,the simulation model of interface thermal resistance between AlN and copper has been built according to the regression analyses by applying Matlab software.The simulation results were reasonable agreement with the cryogenic experiment data of interface thermal resistance.The investigation results were significant for the aerospace thermal control,design of heat transfer of the AlN ceramic and Cu in the application of the cryogenic superconducting devices and integrated circuit chips. |
| |
| Keywords: | interface thermal resistance regression analyses simulation AlN copper |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
