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Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology |
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| Authors: | Cao Yuhan Luo Le |
| Affiliation: | State Key Laboratories of Transducer Technology;Shanghai Institute of Microsystem and Information Technology;Chinese Academy of Sciences;Shanghai 200050;China |
| Abstract: | wafer level package Cu-Sn isothermal solidification technology hermeticity |
| Keywords: | wafer level package Cu-Sn isothermal solidification technology hermeticity |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |