| 电子产品的散热设计 |
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| 引用本文： | 卢申林.电子产品的散热设计[J].电子质量,2004(12):46-48. |
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| 作者姓名： | 卢申林 |
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| 作者单位： | ReliaSoft(中国)有限公司技术中心,哈尔滨,150080 |
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| 摘 要： | 随着电子产品的复杂性提高,产品的发热也随之上升.对于现在的产品设计而言散热已经成为一个挑战,这是每个设计人员都必须面对的问题.本文就热设计做以介绍.
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| 关 键 词： | 热设计 风扇 噪音 温度测量 |
| 文章编号： | 1003-0107(2004)11-0046-03 |
Heat-dissipating Design of Electronic Products |
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| Lu Shen-lin.Heat-dissipating Design of Electronic Products[J].Electronics Quality,2004(12):46-48. |
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| Authors: | Lu Shen-lin |
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| Abstract: | With the Electronic product power increase, the product surface temperature also increase. It have became a challenge for the designer, all of them must face it. This subject will introduce the thermal design. |
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| Keywords: | Thermal design FAN acoustic temperature measure |
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