二氧化硅粉体改性E—Si／CE固化动力学的研究

采用非等温差示扫描量热法（DSC）研究了纳米二氧化硅（SiO2）和微米SiO2的混合粉体改性环氧基硅烷（E—Si）／氰酸酯（CE）树脂体系固化动力学；用Kissinger、Crane和Ozawa法确定固化动力学参数。结果表明，Kissinger式求得的表观活化能为66．09kJ／mol；Ozawa法求得的表观活化能为7001kJ／mol；根据Crane理论计算该体系的固化反应级数为0.89。计算了不同升温速率所对应的不同温度的频率因子和反应速率常数；求得了改性体系的固化工艺参数：凝胶温度130．74℃、固化温度160．96℃和后处理温度199.16℃，确定了体系的最佳固化工艺。与E—Si／CE体系对比表明，SiO2的加入可以降低E—Si／CE体系的活化能，使其固化能在较低温度下进行。

Study on curing kinetics of epoxy group silane/cyanate ester resin modified with silica particle

The non-isothermal curing kinetics of epoxy group silane/cyanate ester resin modified with silica particle composites was investigated by using the differential scanning calorimetry （DSC）. The curing kinetics parameters of the modified system were obtained by Kissinger equation and Ozawa equation. Based on the Kissinger equation and Ozawa equation, the apparent activation energy was 66.09kJ/mol and 70.01kJ/mol, respectively. The order of the curing reaction is 0.89 by Crane＇s theory. Frequency factors and rate constants for the reactions at different temperature in different Heating Rates were calculated. The. curing process parameters were obtained as folloes： gel temperature of 130.74 ℃, curing temperature of 160.96 ℃ and post-treating temperature of 199.16℃. The appropriate solidifying process of modified cyanate ester resin was determined. Compared to the E-Si/CE system, the results indicated that the addition of SiO2 can lower the activation energy of the E-Si/CE system and the curing reaction can occur at a relative low temperature.