一体化封装LED结温测量与发光特性研究

基于一体化封装基板,制备了大功率白光LED。以低热阻的一体化封装基板为基础,设计了结温测量系统。利用光谱仪测得不同结温下LED的光电参数,并对其机理进行了分析。在工作电流为0.34A,所研究温度范围为10.8～114.9℃。实验结果表明,一体化封装的LED结温与正向电压、光通量、光效和色温有着良好的线性关系;结温的变化对主波长及色坐标影响甚微;结温的上升导致蓝光段强度下降且光谱发生红移,黄光段强度上升且光谱发生宽化,峰值波长由450nm转为550nm。

Junction temperature measurement and luminous properties research of the integrated packaged LED

The high-power white LED was prepared based on the integrated packaging.The junction temperature of LEDs was measured based on the integrated packaging substrate with low thermal resistance.The photoelectric parameters under different junction temperatures were measured by spectrometer and the mechanism was researched.The applied current is 0.34 A and the temperature range is from 10.8 ℃ to 114.9 ℃.The results show that the junction temperature has a good linear relationship with forward voltage,luminous flux,luminous efficiency and color temperature.The change of junction temperature has little effect on the dominant wavelength and color coordinate.The rise of junction temperature will lead to decreasing intensity and red shift for blue light spectrum.Meanwhile,the intensity of yellow light is increased,the spectrum is widened,and the peak wavelength shifs from 450 nm to 550 nm.