Interfacial reactions and diffusion path in gold–tin–nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging 期刊界 All Journals 搜尽天下杂志传播学术成果专业期刊搜索期刊信息化学术搜索

Interfacial reactions and diffusion path in gold–tin–nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging

摘要：
本文献已被 SpringerLink 等数据库收录！