Properties of low temperature Sn–Ag–Bi–In solder systems |
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Authors: | Keun-Soo Kim Takayuki Imanishi Katsuaki Suganuma Mimoru Ueshima Rikiya Kato |
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Affiliation: | aISIR, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan;bSenju Metals Industries, Co. Ltd., Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan |
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Abstract: | The metallurgical and mechanical properties of Sn–3.5 wt%Ag–0.5 wt%Bi–xwt%In (x = 0–16) alloys and of their joints during 85 °C/85% relative humidity (RH) exposure and heat cycle test (−40–125 °C) were evaluated by microstructure observation, high temperature X-ray diffraction analysis, shear and peeling tests. The exposure of Sn–Ag–Bi–In joints to 85 °C/85%RH for up to 1000 h promotes In–O formation along the free surfaces of the solder fillets. The 85°C/85%RH exposure, however, does not influence the joint strength for 1000 h. Comparing with Sn–Zn–Bi solders, Sn–Ag–Bi–In solders are much stable against moisture, i.e. even at 85 °C/85%RH. Sn–Ag–Bi–In alloys with middle In content show severe deformation under a heat cycles between −40 °C and 125 °C after 2500 cycles, due to the phase transformation from β-Sn to β-Sn + γ-InSn4 or γ-InSn4 at 125 °C. Even though such deformation, high joint strength can be maintained for 1000 heat cycles. |
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