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Formation of silver and zinc selenide relief patterns by the lift-off photolithography method
Authors:D V Lysich  S V Zelentsov  V E Kotomina  I N Antonov
Abstract:Conducting the lift-off photolithography on silicon wafers with thicknesses of the FP-383 photoresist layers varying from 1.60 ± 0.20 to 4.20 ± 0.20 μm is considered. As a lift-off layer, either a silver layer or zinc selenide layer with a thickness of 80–90 nm was deposited. The edge roughness of the image elements after the lift-off is 5.00 ± 0.20 μm.
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