利用半导体激光选择性烧结的快速成型技术

提出了一种新的基于半导体激光的选择性激光烧结快速成型方法。由若干个单独驱动的高功率半导体激光器形成线阵，经过光学准直器，在工作面上形成若干激光短线，并连成与线阵长度相等的激光线束。扫描方式采用导轨Ｘ－Ｙ联动，不存在振镜扫描的“圆弧效应”，因而提高了质量。

A Rapid Prototyping Technology Based on Laser Diodes Selective Sintering

A new SLS process - rapid prototyping method based on laser diodes energy sources is provided in this paper. A linear array with required length is formed using some high power laser diodes that can be drived individually. Beam of the linear array is transfered to the workplane and imaging into some short and light lines by the corresponding optical collimators. They are lined up in a linear laser beam whose length is equal to that of the linear array diodes. The scanning mode of x-y simultaneous guideways are used in this new system,so the scanning trace is in aligment which differs entirely from the arc caused by vibrating mirror scanning. This new process has better quality than the traditional spot scanning method.