Constraints on monitoring resin flow in the resin transfer molding (RTM) process by using thermocouple sensors |
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| Affiliation: | 1. Université de Nantes, Nantes Atlantique Universités, CNRS, Laboratoire de Thermocinétique de Nantes, CNRS UMR 6607, rue C. Pauc, BP 50609, 44306 Nantes cedex 3, France;2. Université du Havre, Laboratoire d’Ondes et Milieux Complexes, CNRS UMR 6294, 53 rue de Prony, BP 540, 76600 Le Havre, France;1. Ecole Centrale de Nantes, Research Institute in Civil Engineering and Mechanics (GeM), UMR CNRS 6183, 44321 Nantes Cedex 3, France;2. Department of Mechanical Engineering, University of Delaware, Newark, DE 19716, USA;1. Department of Organic Materials and Fiber Engineering, Chonbuk National University, 567 Baekje-daero, Deokjin-gu, Jeonju-si, Jeollabuk-do, Republic of Korea;2. Advanced Material Research Institute, Central Research Park, KOLON INDUSTRIES, INC., 30, Mabukro 154beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea;1. Centre for Microsystems Technology (CMST), IMEC and Ghent University, Technologiepark 15, Gent-Zwijnaarde 9052, Belgium;2. Department of Materials Science and Engineering, Ghent University, Technologiepark 903, Gent-Zwijnaarde 9052, Belgium |
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| Abstract: | In this study, a thermocouple sensor system was used to monitor the resin transfer molding (RTM) process. These sensors are low-cost and durable; and they do not disturb the resin flow. They can be used if the inlet resin is either hotter or colder than the mold walls. In experiments of this study, much of the hot resin’s internal energy was transferred to cold mold walls by conduction, when the mold parts were made of a material with high thermal conductivity, such as aluminum. A mathematical model based on 1D flow and 2D unsteady energy conservation was developed to investigate the heat transfer between resin and mold walls. The numerical solution of this model is in qualitative agreement with the results of our experiments. The thermocouple sensor system developed is more useful with the following process parameters: low thermal conductivity of mold material, high resin flow rate, high temperature difference between inlet resin and initial mold walls, and high specific heat of resin. However, for the typical use of RTM materials and typical injection parameters, thermocouples should not be preferred over other sensor types and should be used with caution due to the shortcomings investigated in this study. |
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