| QFP器件半导体激光钎焊焊点力学性能和显微组织 |
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| 引用本文： | 韩宗杰,薛松柏,王俭辛,陈旭.QFP器件半导体激光钎焊焊点力学性能和显微组织[J].焊接学报,2006,27(10):41-44. |
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| 作者姓名： | 韩宗杰 薛松柏 王俭辛 陈旭 |
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| 作者单位： | 南京航空航天大学,材料科学与技术学院,南京,210016 |
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| 基金项目： | 江苏省六大人才高峰基金 |
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| 摘 要： | 采用半导体激光软钎焊和红外再流焊方法对QFP32和 QFP48两种不同结构尺寸的器件引线进行了钎焊性试验,针对使用Sn-Pb和Sn-Ag-Cu两种不同成分钎料所得到的QFP器件焊点,采用微焊点强度测试仪研究了其抗拉强度的分布规律,并采用扫描电子显微镜分析了焊点断口的显微组织特征.结果表明,同种QFP器件焊点的抗拉强度,半导体激光软钎焊焊点明显高于红外再流焊焊点抗拉强度,QFP48器件焊点抗拉强度明显高于QFP32器件焊点的抗拉强度.半导体激光焊QFP器件焊点的断裂方式为韧性断裂,红外再流焊焊点断裂方式兼有脆性断裂和韧性断裂的特征.
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| 关 键 词： | 半导体激光软钎焊 QFP器件 焊点力学性能 显微组织 |
| 文章编号： | 0253-360X（2006）10-041-04 |
| 收稿时间： | 07 28 2006 12:00AM |
| 修稿时间： | 2006-07-28 |
Mechanical properties and microstructures of QFP micro-joints soldered with diode-laser soldering system |
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| HAN Zong-jie,XUE Song-bai,WANG Jian-xin and CHEN Xu.Mechanical properties and microstructures of QFP micro-joints soldered with diode-laser soldering system[J].Transactions of The China Welding Institution,2006,27(10):41-44. |
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| Authors: | HAN Zong-jie XUE Song-bai WANG Jian-xin and CHEN Xu |
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| Affiliation: | College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China and College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
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| Abstract: | Soldering experiments of two kinds of devices QFP32 and QFP48 were carried out using diode-laser soldering system and IR reflow soldering method,and the distribution regulations of the tensile strength of QFP micro-joints with Sn-Pb solder and Sn-Ag-Cu lead-free solder were studied by STR-1000 micro-joints tester, and the characteristics of fracture microstructures of micro-joints were also analyzed by SEM. The results indicate that tensile strength of QFP micro-joints soldered with laser soldering system is larger than that with IR reflow soldering method,and tensile strength of QFP48 micro-joints is larger than that of QFP32 micro-joints. Fracture mechanism of micro-joints soldered with laser soldering system is toughness fracture, while fracture mechanism of micro-joints soldered with IR reflow soldering method includes brittle fracture and toughness fracture. |
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| Keywords: | diode-laser soldering QFP devices mechanical properties of micro-joints microstructures |
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