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Analysis on the thermal and electrical characteristics of impregnating materials for the bifilar winding-type superconducting fault current limiter |
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| Authors: | Seong Eun Yang Duck Kweon Bae Yong Soo Yoon Sang-Hyun Kim |
| Affiliation: | a Department of Electrical and Electric Engineering, Yonsei University, Republic of Korea b Department of Electrical Engineering, Ansan College of Technology, Republic of Korea c Department of Electrical Engineering, Gyeongsang National University, Republic of Korea |
| Abstract: | The resistive type high temperature superconducting fault current limiter (HTSFCL) limits the fault current with the resistance that generated by fault current. The generated resistance by fault current makes large pulse power which makes the operation of HTSFCL unstable. So, the cryogenic cooling system of the resistive type HTSFCL must diffuse and eliminate the pulse energy very quickly. Although the best way is to make wide direct contact area between HTS winding and coolant as much as possible, HTS winding also need the impregnation layer which fixes and protects it from electromagnetic force. This paper deals with thermal conductivity and dielectric strength of some epoxy compounds for the impregnation of high temperature superconducting (HTS) winding at 77 K. The measured data can be used in the optimal design of impregnation for HTS winding. Aluminar filling increased the thermal conductivity of epoxy compounds. Hardener also affected the thermal conductivity and the dielectric strength of epoxy compounds. |
| Keywords: | HTSFCL Thermal conductivity Dielectric strength |
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