| MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER |
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| 作者姓名： | Y.Zhou C.S.Yang J.A. Chen G.F. Ding L. Wang M.J Wang Y.M Zhang T.H Zhang |
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| 作者单位： | Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，Key Laboratory for Thin Film and Microfabrication of Ministry of Education，Research Institute of Micro/Nanometer Science and Technology，Shanghai Jiaotong University，Shanghai 200030，China，State Key Laboratory of Nonlinear Mechanics (LNM)，Institute of Mechanics，The Chinese Academy of Sciences，Beijing 100080，China. |
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| 摘 要： | Microbridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. In order to measure the mechanicalproperties of nickel film microbridges, special shaft structure is designed to solve theproblem of getting the load--deflection curves of metal film microbridge by Nanoin--denter XP system with normal Berkovich probe. Theoretical analysis of the micro--bridge load--deflection curve is proposed to evaluate the Young's modulus and residualstress of the films simultaneously. The calculated results based on the experimentalmeasurements show that the average Young's modulus and residual stress are around190GPa and 175MPa respectively, while the Young's modulus measured by Nano-hardness method on nickel film with silicon substrate is 186.8±7.34GPa.
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MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER |
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| Y.Zhou,C.S.Yang,J.A. Chen,G.F. Ding,L. Wang,M.J Wang,Y.M Zhang,T.H Zhang.MICROBRIDGE TESTING OF YOUNG''''S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER[J].Acta Metallurgica Sinica(English Letters),2004,17(3). |
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| Authors: | YZhou CSYang JA Chen GF Ding L Wang MJ Wang YM Zhang TH Zhang Key Laboratory for Thin Film and Microfabrication of Ministry of Education Research Institute of Micro/Nanometer Science and Technology Shanghai Jiaotong University Shanghai China State Key Laboratory of Nonlinear Mechanics |
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| Abstract: | |
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| Keywords: | nickel film microbridge MEMS mechanical property loadeflection measurement |
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