| 方形扁平无引线QFN封装的研究及展望 |
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| 引用本文： | 陈建明,翁加林,陈学峰,吾玉珍.方形扁平无引线QFN封装的研究及展望[J].半导体技术,2007,32(3):185-187. |
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| 作者姓名： | 陈建明 翁加林 陈学峰 吾玉珍 |
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| 作者单位： | 苏州固锝电子股份有限公司,江苏苏州215011;苏州固锝电子股份有限公司,江苏苏州215011;苏州固锝电子股份有限公司,江苏苏州215011;苏州固锝电子股份有限公司,江苏苏州215011 |
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| 摘 要： | 方形扁平无引线(QFN)封装是方形扁平封装(QFP)和球栅阵列(BGA)封装相结合发展起来的先进封装形式,是SMT技术中产品体积进一步小型化的换代产品.讨论了QFN技术的改进及工艺自动化发展进程,指出其必将成为半导体器件高端主流封装形式之一.
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| 关 键 词： | 封装 无引线封装 半导体器件 |
| 文章编号： | 1003-353X（2007）03-185-03 |
| 修稿时间： | 2006-10-09 |
Development and View of QFN Package |
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| CHEN Jian-ming,WENG Jia-lin,CHEN Xue-feng,WU Yu-zhen.Development and View of QFN Package[J].Semiconductor Technology,2007,32(3):185-187. |
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| Authors: | CHEN Jian-ming WENG Jia-lin CHEN Xue-feng WU Yu-zhen |
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| Affiliation: | Suzhou Goodark Electronic Co,, Ltd., Suzhou 215011, China |
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| Abstract: | The advanced QFN package(quad flat non-leaded package) is combined with the QFP(quad flat package) and the BGA(ball grid array)package.It is traded era product with the SMT technique become more and more decreasing size.Technical improvement of QFN and automatic development in the technique were discussed.It is pointed out that QFN will become one of the most mainstream in semiconductor device packages. |
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| Keywords: | package non-leaded package semiconductor device |
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