| 印制线路板微孔镀铜研究现状 |
| |
| 引用本文： | 李亚冰,王双元,王为. 印制线路板微孔镀铜研究现状[J]. 电镀与精饰, 2007, 29(1): 32-35,39 |
| |
| 作者姓名： | 李亚冰 王双元 王为 |
| |
| 作者单位： | 天津大学,化工学院,天津,300072 |
| |
| 摘 要： | 印制线路板微孔金属化的关键在于在高厚径比的微孔中形成无空洞、无接缝、均匀的铜沉积层.综述了目前微孔填充技术的发展现状,对电镀过程中采用的电流密度、搅拌因素和电流波形等进行了探讨,重点讨论了添加剂对填孔效果的影响及其作用机理.
|
| 关 键 词： | 印制线路板 微孔 厚径比 添加剂 填孔 脉冲电镀 |
| 文章编号： | 1001-3849（2007）01-0032-04 |
| 收稿时间： | 2006-04-20 |
| 修稿时间： | 2006-04-20 |
Development Status of Copper Via-filling for PCB |
| |
| LI Ya-bing,WANG Shuang-yuan,WANG Wei. Development Status of Copper Via-filling for PCB[J]. Plating & Finishing, 2007, 29(1): 32-35,39 |
| |
| Authors: | LI Ya-bing WANG Shuang-yuan WANG Wei |
| |
| Affiliation: | School of Chemical Engineering and Technology, Tianjin Unviersity, Tianjin 300072, China |
| |
| Abstract: | The crucx of PCB via filling is to form a void-free, seam-free and uniform deposit layer. Development status of via-filling technique was summarized, and the parameters applied to the via-filling, which includes the current density, the mode of agitation and waveform of current were also discussed. Effect of additives on the via-filling performance and their mechanisms of action were discussed emphatically. |
| |
| Keywords: | PCB microvia aspect ration additive via-filling pulse electroplating |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
