| 工序能力指数评价在可靠性试验中的应用 |
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| 引用本文： | 杜迎,亢亚军. 工序能力指数评价在可靠性试验中的应用[J]. 半导体技术, 2004, 29(11): 29-31,48 |
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| 作者姓名： | 杜迎 亢亚军 |
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| 作者单位： | 中国电子科技集团公司第五十八研究所,江苏,无锡,214035;陕西群力无线电器材厂,陕西,宝鸡,721300 |
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| 摘 要： | 讲述了工序能力指数(CPK)评价的用途,可靠性试验中使用CPK所能起到的作用,提出了进行该评价的具体实施步骤.对于在热冲击试验前后的键合拉力进行了工序能力指数评价,并对试验结果进行了分析,得出了结论.
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| 关 键 词： | 工序能力指数评价 可靠性试验 键合拉力 |
| 文章编号： | 1003-353X(2004)11-0029-03 |
Application of Working Procedure Ability Estimation to Fail-tests |
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| DU Ying,KANG Ya-jun. Application of Working Procedure Ability Estimation to Fail-tests[J]. Semiconductor Technology, 2004, 29(11): 29-31,48 |
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| Authors: | DU Ying KANG Ya-jun |
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| Affiliation: | DU Ying1,KANG Ya-jun2 |
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| Abstract: | The use of the procedure ability estimation and operation for Cpk in fail-tests aredescribed. The implementary steps for Cpk are put forward. The working procedure ability forwirebonding force before thermal shock test and after thermal shock test were estimated. The resultin test are analyzed,and a conclusion is given. |
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| Keywords: | working procedure ability estimation fail-tests wirebonding force. |
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