Diffusion soldering using a Gallium metallic paste as solder alloy: study of the phase formation systematics |
| |
Authors: | Silvana Sommadossi Horacio E Troiani Armando Fernández Guillermet |
| |
Affiliation: | (1) Facultad de Ingeniería, Universidad Nacional del Comahue/CONICET, Buenos Aires 1400, 8300, Neuquen, Argentina;(2) Centro Atómico Bariloche, Comisión Nacional de Energía Atómica/CONICET, Bustillo 9500, R8402AGP San Carlos de Bariloche, Argentina |
| |
Abstract: | In this work preliminary results are reported on the characterization of Pb-free joints produced by using a diffusion soldering
method at a process temperature of 700 °C during 20 min. The solder alloy is a metallic paste involving Ga and Al and Ni powder,
and the substrates are Cu and Ni. The dissolution and diffusion-reaction processes, which take place at the interfaces of
the interconnection zone, have been investigated by means of SEM and EPMA. A solid solution and intermetallic compounds (IMCs)
with high melting point form as layers almost free from defect, allowing service temperatures about 500 °C higher than the
process temperature. The phase stability sequence starting from the Ni to the Cu interface is the following: α′-Ni3Ga, γ-Cu9Ga4, β-Cu3Ga and (Cu) solid solution of the Ga–Cu system. The relative reaction front displacement of the layers and the implications
of the present findings for the applicability of the diffusion-soldering method are also discussed. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|