首页 | 本学科首页   官方微博 | 高级检索  
     

梯度结构聚晶金刚石复合片残余热应力的有限元分析
引用本文:曹品鲁,刘宝昌,殷琨. 梯度结构聚晶金刚石复合片残余热应力的有限元分析[J]. 探矿工程(岩土钻掘工程), 2006, 33(3): 50-53
作者姓名:曹品鲁  刘宝昌  殷琨
作者单位:吉林大学建设工程学院,吉林,长春,130026
摘    要:利用Ansys有限元分析软件,对梯度结构聚晶金刚石复合片在制造过程中产生的残余热应力进行了分析,并与传统的双层结构金刚石-硬质合金复合片的残余热应力进行了对比。结果表明,和双层结构复合片相比,梯度结构聚晶金刚石复合片的轴向拉应力由698MPa降到了283MPa,径向拉应力由1470MPa降低到880MPa,剪应力由653MPa降到368MPa,此外还改善了界面处的应力分布,大大提高了界面的结合强度。

关 键 词:功能梯度材料  聚晶金刚石复合片  残余热应力  有限元分析
文章编号:1672-7428(2006)03-0050-04
收稿时间:2005-11-29
修稿时间:2005-11-29

Finite Element Analysis of Residual Thermal Stress in Functionally Graded Polycrystalline Diamond Compact
CAO Pin-lu,LIU Bao-chang and YIN Kun. Finite Element Analysis of Residual Thermal Stress in Functionally Graded Polycrystalline Diamond Compact[J]. Exploration Engineering (Rock & Soil Drilling and Tunneling), 2006, 33(3): 50-53
Authors:CAO Pin-lu  LIU Bao-chang  YIN Kun
Affiliation:College Construction Engineering, Jilin University;College Construction Engineering, Jilin University;College Construction Engineering, Jilin University
Abstract:Residual thermal stress of functionally graded polycrystalline diamond compact was analyzed by the finite element method with ANSYS software. It was showed that the axial tensile stress in functionally graded polycrystalline diamond compact was reduced from 698MPa to 283 MPa compared with two layer polycrystalline diamond compact, radial tensile stress was reduced from 1770 MPa to 880 MPa, and shear stress was reduced from 653 MPa reduced down to 368 MPa. In addition, the stress distribution is improved in the interface of functionally graded polycrystalline diamond compact, and bond strength are greatly increased.
Keywords:functionally graded materials   polycrystalline diamond compact   residual thermal stress   finite dement analysis
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《探矿工程(岩土钻掘工程)》浏览原始摘要信息
点击此处可从《探矿工程(岩土钻掘工程)》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号