| 微电子封装技术对SMT的促进作用 |
| |
| 引用本文： | 况延香,朱颂春. 微电子封装技术对SMT的促进作用[J]. 电子工艺技术, 2004, 25(1): 42-45 |
| |
| 作者姓名： | 况延香 朱颂春 |
| |
| 作者单位： | 中国电子科技集团公司第43研究所,安徽,合肥,230022 |
| |
| 摘 要： | SMD是SMT的三要素之一,并为SMT的基础;而微电子封装技术,特别是先进IC封装技术又是SMD的基础与核心,并深刻地影响着SMT其它要素--SMT设备和SMT工艺技术的发展与提高,从而推动SMT向更高层次发展.这一期重点论述微电子封装技术,特别是先进IC封装技术对SMT的挑战与推动.
|
| 关 键 词： | 微电子封装 先进IC封装 |
| 文章编号： | 1001-3474(2004)01-0042-04 |
| 修稿时间： | 2003-11-10 |
Promotion of SMT on Micro - electronic Packaging |
| |
| KUANG Yan - xiang,ZHU Song - chun. Promotion of SMT on Micro - electronic Packaging[J]. Electronics Process Technology, 2004, 25(1): 42-45 |
| |
| Authors: | KUANG Yan - xiang ZHU Song - chun |
| |
| Abstract: | SMD is one of the three elements of SMT, and is a basis for SMT; while microelectronic packaging especially the advanced IC packaging serves as a basis and core of SMD, and has a profound impact on the other elements of SMT-SMT equipment and the development and promotion of SMT, which therefore pushes SMT forward to a higher level. Expound the microelectronic technology, in particular the challenge and promotion of SMT made by IC technology. |
| |
| Keywords: | SMD SMT |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
