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MICROSTRUCTURE AND INDENTATION BEHAVIOUR OF MULTILAYER Ti-N FILM
作者姓名:WAGENDRISTEL A  BANGERTH  PANGRATZH  SKALICKYP
作者单位:Viena Technical Univessity Austria,Viena Technical University,Austria,Viena Technical University,Austria,Viena Technical University,Austria
摘    要:The microstructure of Ti/TiN multilayer film was studied.It was shown by trans-mission electron microscopy of cross-sectional sample and respective secondary neutralsmass-spectroscopy depth profiling that the film has a periodic alternate multilayeredstructure:substrate /FeTi/Ti/Ti_2N/TiN/Ti_2N/Ti/Ti_2N/TiN...Ti/Ti_2N/TiN,whereFeTi and Ti_2N were the transition layers formed during ion plating.Cross-sectionalfracture surface of indentation samples had been obtained and studied with scanningelectron microscopy.It was shown that the multilayer film deformed during indentation,formed an indentation pit and a pile-up of materials around the indentation pit.As theapplied load increased deformation region extended beyond the film/substratc interfaceand into the substrate,the interlayer crack in the film and hole formation at the film/substrate interface were initiated.It is also shown that the multilayered Ti/TiN filmoffered better toughness in comparison with single layer TiN film.

收稿时间:1993-07-11
修稿时间:1993-07-11

MICROSTRUCTURE AND INDENTATION BEHAVIOUR OF MULTILAYER Ti-N FILM
WAGENDRISTEL A,BANGERTH,PANGRATZH,SKALICKYP.MICROSTRUCTURE AND INDENTATION BEHAVIOUR OF MULTILAYER Ti-N FILM[J].Acta Metallurgica Sinica(English Letters),1993,6(7):29-34.
Authors:WAGENDRISTEL A Viena Technical Univessity  AustriaHUANG Rongfang Institute of Metal Research  Academia Sinica  Shenyang  ChinaBANGERT H YANG Xia WU Lihang WANG Haifeng PANGRATZ H SKALICKY P Viena Technical University  Austria Associate Professor
Affiliation:WAGENDRISTEL A Viena Technical Univessity,AustriaHUANG Rongfang Institute of Metal Research,Academia Sinica,Shenyang,ChinaBANGERT H YANG Xia WU Lihang WANG Haifeng PANGRATZ H SKALICKY P Viena Technical University,Austria Associate Professor,Institute of Metall Research,Academia Sinica,Shenyang,China
Abstract:The microstructure of Ti/TiN multilayer film was studied.It was shown by trans- mission electron microscopy of cross-sectional sample and respective secondary neutrals mass-spectroscopy depth profiling that the film has a periodic alternate multilayered structure:substrate /FeTi/Ti/Ti_2N/TiN/Ti_2N/Ti/Ti_2N/TiN...Ti/Ti_2N/TiN,where FeTi and Ti_2N were the transition layers formed during ion plating.Cross-sectional fracture surface of indentation samples had been obtained and studied with scanning electron microscopy.It was shown that the multilayer film deformed during indentation, formed an indentation pit and a pile-up of materials around the indentation pit.As the applied load increased deformation region extended beyond the film/substratc interface and into the substrate,the interlayer crack in the film and hole formation at the film /substrate interface were initiated.It is also shown that the multilayered Ti/TiN film offered better toughness in comparison with single layer TiN film.
Keywords:multilayer Ti-N film  microstructure  indentation
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