| 无铅焊料Sn-Ag-Sb系列合金的研究与开发 |
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| 引用本文： | 杨志,孙勇,吴敏. 无铅焊料Sn-Ag-Sb系列合金的研究与开发[J]. 材料导报, 2006, 20(7): 141-143 |
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| 作者姓名： | 杨志 孙勇 吴敏 |
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| 作者单位： | 昆明理工大学云南省新材料制备与加工重点实验室,昆明,650093;昆明理工大学云南省新材料制备与加工重点实验室,昆明,650093;昆明理工大学云南省新材料制备与加工重点实验室,昆明,650093 |
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| 摘 要： | 采用均匀设计方法对Sn-Ag-Sb系无铅焊料合金进行合金设计,并对其焊料合金进行了熔点、剪切强度及微观组织等研究分析,结果表明:Sb的加入,对Sn-Ag-Sb系合金熔点下降的影响较小,Ag、Sb在Sn基体中形成Ag3Sn和SbSn相,形成良好弥散强化,因此使得焊料合金具有较高的机械强度.
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| 关 键 词： | 无铅焊料 熔点 Sn-Ag-Sb |
Research and Development of Sn-Ag-Sb Lead-free Based Solders |
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| YANG Zhi,SUN Yong,WU Min. Research and Development of Sn-Ag-Sb Lead-free Based Solders[J]. Materials Review, 2006, 20(7): 141-143 |
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| Authors: | YANG Zhi SUN Yong WU Min |
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| Affiliation: | Kunming University of Science and Technology, Key Laboratory of Advanced Materials of Yunnan Province, Kunming 650093 |
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| Abstract: | The optimal composition of Sn-Ag-Sb lead-free solders are studied through uniform design experiment method. In addition, solidus temperature, shearing strength, and microstructure of soliders are analyzed. The results show that Sb has very little influence on lowering the solidus temperature of Sn-Ag-Sb solder. Ag and Sb can form the phases of Ag3 Sn and SbSn in Sn matrix, and the new phases can perform a dispersion strengthening effect in matrix. Therefore, these lead-free solders can have high mechanical properties. |
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| Keywords: | Sn-Ag-Sb |
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