A review of passive thermal management of LED module |
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| Authors: | Ye Huaiyu Sau Koh Henk van Zeijl A W J Gielen and Zhang Guoqi |
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| Affiliation: | Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628CD, Delft, Netherlands; Materials Innovation Institute (M2i), Mekelweg 2, 2628 CD, Delft, Netherlands;Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628CD, Delft, Netherlands; Materials Innovation Institute (M2i), Mekelweg 2, 2628 CD, Delft, Netherlands;Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628CD, Delft, Netherlands;Netherlands Organization for Applied Scientific Research (TNO), De Rondom 1, 5612 AP, Eindhoven, Netherlands;Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628CD, Delft, Netherlands |
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| Abstract: | Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module. |
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| Keywords: | HB LEDs LED module thermal management passive thermal solution thermal interface material |
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