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A comparison of the strength of multilayers,thin films and nanocrystalline compacts
Affiliation:1. Physics Department, Science and Literature Faculty, Balikesir University, Balikesir 10145, Turkey;2. Physics Department, Science and Literature Faculty, Uludag University, Gorukle, Bursa 16059, Turkey;1. Advanced Mechanical and Materials Characterization Division, CSIR-Central Glass and Ceramic Research Institute, Kolkata, 700032, India;2. Department of Physics, School of Basic Sciences, Faculty of Science, Manipal University Jaipur, Jaipur 303007, Rajasthan, India;3. Department of Engineering Science and Humanities, Siliguri Institute of Technology, Techno India Group, Hill Cart Road, P.O. Sukna, Siliguri, 734009, India;1. Department of Materials Science, Osaka Prefecture University, 1-1, Gakuen-cho, Sakai, Osaka 599-8531, Japan;2. Structural Materials Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 2266-98 Shimo-Shidami, Moriyama-ku, Nagoya 463-8560, Japan;1. School of Engineering, The University of Newcastle, Callaghan, NSW 2308, Australia;2. Department of Information Technology, Uppsala University, Sweden
Abstract:A survey of the yield strength and hardness of copper-based materials shows a progressive lowering of the strength with respect to the extrapolation of the Hall–Petch relation as the length scale of the microstructure decreases. The overall trend can be modeled by scaling the elastic screening length for the dislocation line tension with the microstructural length scale, as proposed by Scattergood and Koch.
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