| 分步电镀法制备Sn-Ag-In三元凸点及其可靠性 |
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| 引用本文： | 王栋良,袁媛,罗乐.分步电镀法制备Sn-Ag-In三元凸点及其可靠性[J].半导体学报,2011,32(8):083005-6. |
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| 作者姓名： | 王栋良 袁媛 罗乐 |
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| 作者单位： | 中科院上海微系统与信息技术研究所,中科院上海微系统与信息技术研究所,中科院上海微系统与信息技术研究所 |
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| 摘 要： | 本文介绍了一种制备细节距、元素分布均匀的Sn-Ag-In三元凸点的方法。其特征在于在Cu凸点下金属层上分步电镀Sn-Ag和In，通过精确控制回流过程，获得了Sn1.8Ag9.4In凸点。研究发现位于Sn-Ag-In焊料和Cu之间的金属间化合物厚度随回流时间的延长而生长，这使得焊料基体中Ag相对浓度增加，因此在凝固过程中，更多的Ag2In相析出，起到了颗粒增强的作用。
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| 关 键 词： | 焊料凸点 电镀锡 序列 三元 可靠性 银 制备 金属间化合物 |
| 收稿时间： | 1/3/2011 6:02:43 PM |
| 修稿时间： | 3/28/2011 5:25:01 PM |
Preparation of Sn-Ag-In Ternary Solder Bumps by Electroplating in Sequence and Reliability |
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| Wang Dongliang,Yuan Yuan and Luo Le.Preparation of Sn-Ag-In Ternary Solder Bumps by Electroplating in Sequence and Reliability[J].Chinese Journal of Semiconductors,2011,32(8):083005-6. |
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| Authors: | Wang Dongliang Yuan Yuan and Luo Le |
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| Affiliation: | Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences |
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| Abstract: | This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution. The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization (UBM) in sequence. After an accurate reflow process, Sn1.8Ag9.4In solder bumps are obtained. It is found that the intermetallic compounds (IMCs) between Sn-Ag-In solder and Cu grow with the reflow time, which results in the increase of Ag concentration in solder area. So during solidification, more Ag2In nucleates and strengthens the solder. |
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| Keywords: | Sn-Ag-In solder bumps electroplating microstructure shear strength |
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