负偏压对多弧离子镀 TiN 涂层大颗粒形貌及像素分布的影响

目的分析不同负偏压下Ti N涂层表面的大颗粒数量、尺寸和面积以及像素分布,为多弧离子镀技术的工业化应用提供基础数据。方法采用多弧离子镀膜技术,以脉冲负偏压为变量,在硬质合金表面沉积Ti N涂层。用扫描电子显微镜对涂层表面形貌进行表征,并利用Image J软件对表面大颗粒的数量和尺寸进行分析,对像素分布进行统计。结果随着负偏压的增加,涂层表面大颗粒的数量先增多,后减少。负偏压为100 V时,大颗粒数量最多,为1364;负偏压为300 V时,大颗粒数量最少,为750。此外随着负偏压的增加,大颗粒所占涂层面积比逐渐减小。未加负偏压时,涂层表面大颗粒所占面积比最大,为6.9%,且此时涂层的力学性能最差;采用400 V负偏压时,涂层表面大颗粒所占面积比最小,为3.3%,且此时涂层的力学性能最好。负偏压为300 V时,亮、暗像素点的个数最多,为8302;负偏压为400 V时,亮、暗像素点的个数最少,为4067。结论当占空比为30%,沉积时间为1 h,负偏压为400 V时,获得的涂层力学性能最好,颗粒数量少且尺寸小。

Influence of Negative Bias Voltage on Microparticles Morphology and Pixel Distribution of TiN Coatings Deposited by Multi-arc Ion Plating

Objective To analyze the microparticles (MPs) morphology and pixel distribution of TiN coatings under different negative bias voltage (0, 100, 200, 300 and 400V), so as to provide basic data for industrial applications of multi-arc ion plating. Methods TiN coatings were deposited on hard alloy surface by multi-arc ion plating at different bias voltage. The surface morphology of TiN coatings was characterized by scanning electron microscope (SEM). At the same time, the amount and size of MPs were analyzed and the distribution of pixel was counted by ImageJ software. Results The amount of MPs on coating surface increased at first and then decreased with the increase of bias voltage. The maximum value was 1364 at 100 V and the minimum was 750 at 300 V. In addition, the area ratio of MPs on coating surface decreased gradually with the increase of bias voltage. The maximum value with worst mechanical properties was 6. 9% at 0 V and the minimum with best mechanical properties was 3. 3% at 400 V. The amount of light and dark pixel reached a maximum of 8302 at 300 V and a minimum of 4067 at 400 V. Conclusion The TiN coatings with best mechanical properties, low amount and small size of MPs were deposited at 400 V for 1 h with 30% duty cycle.