基于电子器件失效分析流程对失效LED分析方法的研究

结合一般电子器件失效分析方法，系统地设计了针对已失效LED器件的分析流程，并从封装结构和光、热特性几个方面比较了LED与一般器件失效分析方法的不同之处。通过分析发现了一般分析难以检测到的表面污染物污染、内部芯片断层等失效模式。实验证明,此方法对判断LED失效模式、推测失效机理更加准确，并可以有效地避免一般分析方法中过早的破坏性分析引入的损伤，以及将光电检测中电流和温度应力导致的损伤误判为器件原有失效因素。

Study on LED Failure Analysis Method Based on Electronic Device Failure Analysis Theory

In reference to the general electronic device failure analysis method,a systematic LED failure analysis process is proposed.The differences and similarities in package structure,light,and heat transfer characteristics between LED and general electronic devices are analyzed.Based on the analysis,it discovers some failure modes,such as the chip surface pollutants and internal chip faults,that are difficult to be detected by the existing methods.Experiments show that the proposed analysis method is more accura...