| Abstract: | The mold array process plastic ball grid array continues to demonstrate progress as a cost-effective, medium to high performance electronics package. Highly manufacturable and reliable solutions to the challenges of molding up to several hundred packages at one time as well as subsequent singulation of the packages have been found. JEDEC moisture performance at up to Level 1 with 220°C reflow temperatures has been qualified for production. Thermal performance remains critically dependent on die size, package size, and motherboard construction. |
