| 暗裂失效问题解析 |
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| 引用本文： | 王殿年,李进,郭本东. 暗裂失效问题解析[J]. 电子与封装, 2011, 11(3): 10-12,17 |
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| 作者姓名： | 王殿年 李进 郭本东 |
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| 作者单位： | 长兴电子材料有限公司,江苏,昆山,215301 |
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| 摘 要： | 封装产品在封装及封装后的制程中均有可能发生CRACK(暗裂)现象,对于CRACK问题严重的产品能在后续的测试工段及时发现,但对于一些暗裂的封装产品极有可能不能被发现,导致流失到客户端,从而发生客诉问题,严重的会有赔偿问题的产生.文章从封装产品用原材料本身和制程中可能影响的因素进行解析,并提出相关建议,以降低或避免类似问...
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| 关 键 词： | 封装产品 暗裂 环氧模塑料 |
Fail Analysis of CRACK |
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| WANG Dian-nian,LI Jin,GUO Ben-dong. Fail Analysis of CRACK[J]. Electronics & Packaging, 2011, 11(3): 10-12,17 |
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| Authors: | WANG Dian-nian LI Jin GUO Ben-dong |
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| Affiliation: | WANG Dian-nian,LI Jin,GUO Ben-dong(Eternal Electronic Materials Co.Ltd.Kunshan 215301,China) |
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| Abstract: | Packages after the molding and molding process may occur the phenomenon of crack,the serious crack products can be found in the follow-up test section in time,but for some minor crack of the packages that could not be found,and shipped to the client,which occurred in customer action,there will be compensation for the serious problems arise,the paper packaging products from raw materials used in the manufacturing process itself and the factors that may affect the analysis,and make recommendations to reduce o... |
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| Keywords: | package crack epoxy molding compound |
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