| 无氰镀金工艺的研究 |
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| 引用本文： | 曹人平,肖士民. 无氰镀金工艺的研究[J]. 电镀与环保, 2006, 26(1): 11-14 |
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| 作者姓名： | 曹人平 肖士民 |
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| 作者单位： | 华南理工大学,化学科学学院,广东,广州,510640;华南理工大学,化学科学学院,广东,广州,510640 |
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| 摘 要： | 由于氰化物镀金含有剧毒的氰化物,为了保护工人的身体健康和减少对环境的污染,研究亚硫酸盐无氰镀金工艺,该工艺可以得到耐蚀性优良、抗变色性能好、导电性好、焊接性好、接触电阻低,且稳定、耐高温、质软、耐磨的镀金层,同时介绍了镀金时应注意的事项和影响因素.
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| 关 键 词： | 无氰 镀金 工艺研究 |
| 文章编号： | 1000-4742（2006）01-0011-04 |
| 收稿时间： | 2005-07-28 |
| 修稿时间： | 2005-07-28 |
A Study of Cyanide-free Gold Plating Process |
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| CAO Ren-ping,XIAO Shi-min. A Study of Cyanide-free Gold Plating Process[J]. Electroplating & Pollution Control, 2006, 26(1): 11-14 |
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| Authors: | CAO Ren-ping XIAO Shi-min |
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| Affiliation: | Faculty of Chemistry Science, South China University of Technology, Guangzhou 510640 |
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| Abstract: | Since highly toxic cyanide is involved in cyanide electroplating, to protect platers' health and diminish pollution to environment, a cyanide-free sulfite gold plating technology is studied. With this process, you can get a gold coating characterized by good corrosion resistance, tarnish resistance, conductivity and soldering property, low and reliable contact resistance, high temperature resistance, good ductility and wear resistance, etc. The cautions and affecting factors during the plating are also described. |
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| Keywords: | cyanide-free gold electroplating process study |
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