Analysis for deformation behavior of multilayer ceramic capacitor based on multiscale homogenization approach

Given the rapid improvements in the miniaturization, functionality, and efficiency of electronic products in recent years, the dielectric layers and electrodes of multilayer ceramic capacitors have become thinner, with the number of stacked layers also increasing. As a result, the deformation defects induced during manufacturing of the capacitors have increased. In this study, the deformation behavior of a multilayer ceramic capacitor composed of ceramic dielectric layers and Ni electrode layers during the compression process was analyzed numerically using the FEM. To analyze the deformation behavior of the capacitor, which consisted of several hundred laminated ceramic and Ni layers, in the plane direction, the material properties were represented by equivalent material properties based on the multiscale homogenization approach. Then, the deformation of the capacitor in the plane direction owing to the residual stress arising during the compression process was analyzed based on the calculated equivalent material properties. Finally, the possibility of a product defect with the size of the ceramic dielectric and electrode layers during the cutting process was predicted.