| BGA器件的筛网印刷考虑 |
| |
| 引用本文： | 胡志勇.BGA器件的筛网印刷考虑[J].印制电路信息,2006(4):60-63. |
| |
| 作者姓名： | 胡志勇 |
| |
| 摘 要： | 新一代的SMT器件都给工程师们和管理人员带来了材料涂布方面的挑战,BGA器件也不能例外。目前所开发的技术已经能够满足以高速度、高精度和高可靠性来进行焊膏的筛网印刷涂布操作。
|
| 关 键 词： | BGA器件 筛网印刷 表面贴装技术 |
Screen Printing for BGA Component |
| |
| Hu Zhiyong.Screen Printing for BGA Component[J].Printed Circuit Information,2006(4):60-63. |
| |
| Authors: | Hu Zhiyong |
| |
| Abstract: | Each new generation of SMT device adds to the material deposition challenges facing packagingengineers and managers, and BGAs are certainly no exception. Technologies are now available for the stencil printingdeposition of solder pastes with greater speed, precision and repeatability. |
| |
| Keywords: | BGA component screen printing surface mount technology |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
